Mechanical Engineering

Today’s technological advancements in electronic systems are characterized by high feature density, complexity of designs and miniaturized sizes. The successful track record of our team in electronic packaging ranges from miniature retrofit electronics design to thermally critical power electronics for air conditioners and everything in-between.

Capabilities

Packaging design

  • Sheet Metal and Plastic Enclosures

  • 3D Modeling

  • Metal and Plastic Casting, Plastic 3D Printing

  • Thermal Analysis

  • Prototyping

Manufacturing readiness

  • Tooling Management

  • Tooling Cost / Risk Analysis

  • Vendor Evaluation and Selection

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  • Thermal Architecture

  • Thermal Analysis using Computational Fluid Dynamics (CFD) Modeling

  • Heat sink Design, Selection and Customization

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